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曝台积电4nm工艺的高通骁龙8Gen1+样片依然发热 - 站长搜索
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曝台积电4nm工艺的高通骁龙8Gen1+样片依然发热

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2021-12-14 00:15:14 转载来源: IT之家

众所周知,高通新一代骁龙8 Gen1芯片代号为sm8450,优化版的Plus版本即 sm8475(若按照之前命名方式或为8 Gen1+)。手握最新供应链情报的数码博主 @数码闲聊站 今日透露,采用台积电4nm工艺的联发科天玑9000(mt6893)和高通 sm8475目前来看还是有点发热,哪怕是目前最先进的工艺也无法降低其太多功耗

众所周知,高通新一代骁龙8 Gen1芯片代号为sm8450,优化版的Plus版本即 sm8475(若按照之前命名方式或为8 Gen1+)。

手握最新供应链情报的数码博主 @数码闲聊站 今日透露,采用台积电4nm工艺的联发科天玑9000(mt6893)和高通 sm8475目前来看还是有点发热,哪怕是目前最先进的工艺也无法降低其太多功耗。

据称,各大厂商都已经在测试搭载全新旗舰平台的新机,而且高通和联发科还将推出新的中端 SoC 来推进市场占有率,新平台预计将包括天玑7000系列和 sm74开头的高通新平台。

部分小伙伴对于三星和台积电的工艺有所看法,但目前来看先进制程的高端芯片发热并不是单一的工艺问题,而且集成电路产生热量是不可避免的情况,甚至之前的海思麒麟9000和苹果 A15也因为发热问题被苛责。

高通骁龙810是台积电代工,之后的数代骁龙8系芯片由三星代工,包括骁龙820、骁龙835和骁龙845等,后续骁龙855、骁龙865系列转向台积电,三星代工的还有骁龙765系列等。

标签: 曝台 积电 4nm 工艺 高通 骁龙 8Gen1+ 样片 依然


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