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传IBM重启剥离芯片业务谈判 - 站长搜索
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传IBM重启剥离芯片业务谈判

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2014-10-07 19:53:35 转载来源: 网络整理/侵权必删

传IBM重启剥离芯片业务谈判

站长搜索讯 10月7日,消息人士周一透露,IBM与半导体制造企业Globalfoundries已重启谈判,旨在让IBM剥离亏损的芯片制造部门。

消息人士在今年7月时透露,IBM与Globalfoundries的谈判在今年7月破裂,原因是IBM只同意向后者支付约10亿美元现金,以剥离亏损的芯片制造部门。消息人士周一透露,如今为了让Globalfoundries接手自己的芯片制造业务,IBM方面愿意支付更多的现金。

IBM愿意与Globalfoundries重启谈判,并付费剥离亏损的芯片制造业务,表明这家公司已坚定决心剥离盈利性不强的业务。在连续9个季度营收出现下滑之后,IBM首席执行官罗睿兰(Ginni Rometty)在实现2015年业绩目标的问题上正面临着极大的压力。

截至目前,IBM发言人艾德·巴比尼(Ed Barbini)及Globalfoundries发言人均对此报道未予置评。

IBM与Globalfoundries关于剥离芯片制造业务的谈判在今年已断断续续进行了多次。不过剥离亏损的芯片制造部门,并不意味着IBM未来不再对芯片产业进行投资。

消息人士在今年2月份曾表示,IBM希望保留对该公司使用的芯片的设计和知识产权的控制权。这家公司计划在未来5年内投入30亿美元,用于半导体的研发。

知识产权

彭博社在今年6月报道称,消息人士透露,Globalfoundries对获取IBM的技术人员和知识产权更感兴趣,而不是后者的制造工厂。该消息当时曾表示,Globalfoundries希望成为IBM芯片的供应商。由阿布扎比政府投资机构控股的Globalfoundries,认为IBM的芯片工厂设施过于成就,没有任何的价值。

消息人士在7月份曾透露,Globalfoundries希望获得IBM大约20亿美元的现金,用于弥补后者芯片部门的亏损。

IBM提交给美国证券交易委员会的报告显示,该公司的芯片制造业务营收在今年上半年下滑了17%。在IBM去年1000亿美元的营收当中,来自芯片制造部门的营收所占比例不足2%。 (无忌)

标签: IBM 重启 剥离 芯片 业务 谈判


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